Low-dielectric heat-conducting polyimide film and preparation method thereof

The invention discloses a low-dielectric heat-conducting polyimide film and a preparation method thereof, and the low-dielectric heat-conducting polyimide film comprises the following raw materials by weight: 10 to 15 parts of a dianhydride monomer, 10 to 15 parts of a diamine monomer, 100 to 150 parts of a solvent B, 0.1 to 0.2 part of a heat-conducting filler, 0.05 to 0.1 part of a coupling agent, 0.05 to 0.1 part of an auxiliary agent, and 100 to 150 parts of a solvent A; the low-dielectric heat-conducting polyimide film is prepared by the following steps: preparing low-dielectric heat-conducting composite powder, synthesizing polyamide acid, filtering, discharging bubbles, pre-forming a film, and forming the film by imidization, thereby obtaining the low-dielectric heat-conducting polyimide film. According to the low-dielectric heat-conducting polyimide film obtained by the preparation method disclosed by the invention, the polyimide film obtained by adding the heat-conducting filler and the auxiliary age