Process for manufacturing conductive circuit

The invention discloses a process for manufacturing a conductive circuit. The process comprises the following steps: S1, combining a base material layer material and a protective layer material which are prepared in advance through a compounding process; s2, performing die cutting on the substrate layer by using a die cutting process to form a parting line of a circuit area and a non-circuit area; s3, performing vacuum plating of a metal layer on the whole base material layer by using a vacuum plating process; s4, removing the unwanted metal layer in the base material layer, and reserving the required metal layer; and S5, covering the base material layer attached with the metal layer with another protective layer. The technical problems that in the prior art, a silk-screen circuit is high in use cost, insufficient in bonding strength and single in selected material are solved. 本发明公开了一种制造导电线路的工艺，其包括如下步骤：S1：将预先备好的基材层材料与保护层材料通过复合工艺相结合；S2：使用模切工艺对基材层模切出线路与非线路区域的分割线；S3：使用真空镀工艺对基材层整体进行真空镀金属层；S4：去除基材层中不需要的金属层，保留所需的金属