Semiconductor packaging structure

The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN ZIHONG, LIU NAIWEI, QI YANYAO, XU WENSONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!