Semiconductor packaging structure

The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN ZIHONG, LIU NAIWEI, QI YANYAO, XU WENSONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die and the first molding compound layer; a second molding compound layer formed on the first redistribution layer structure; an insulating cover layer covering the second molding compound layer; and a first antenna electrically coupled to the semiconductor die, including: a first antenna element formed in the first redistribution layer structure; and a second antenna element formed between the second molding compound layer and the insulating cover layer. Therefore, the insulating covering layer can be used for protecting the second antenna element, antenna oxidation and surface damage during testing are avoided, the second antenna element can be reinforced, and the possibility that the second antenna element falls off