Semiconductor packaging structure

Semiconductor packaging structure

The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die...

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Hauptverfasser: LIN ZIHONG, LIU NAIWEI, QI YANYAO, XU WENSONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIN ZIHONG
LIU NAIWEI
QI YANYAO
XU WENSONG
description The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die and the first molding compound layer; a second molding compound layer formed on the first redistribution layer structure; an insulating cover layer covering the second molding compound layer; and a first antenna electrically coupled to the semiconductor die, including: a first antenna element formed in the first redistribution layer structure; and a second antenna element formed between the second molding compound layer and the insulating cover layer. Therefore, the insulating covering layer can be used for protecting the second antenna element, antenna oxidation and surface damage during testing are avoided, the second antenna element can be reinforced, and the possibility that the second antenna element falls off
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114864559A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114864559A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114864559A3</originalsourceid><addsrcrecordid>eNrjZFAMTs3NTM7PSylNLskvUihITM5OTM_MS1coLikCCpUWpfIwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NRioI7UvNSSeGc_Q0MTCzMTU1NLR2Ni1AAAwl0mUw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor packaging structure</title><source>esp@cenet</source><creator>LIN ZIHONG ; LIU NAIWEI ; QI YANYAO ; XU WENSONG</creator><creatorcontrib>LIN ZIHONG ; LIU NAIWEI ; QI YANYAO ; XU WENSONG</creatorcontrib><description>The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die and the first molding compound layer; a second molding compound layer formed on the first redistribution layer structure; an insulating cover layer covering the second molding compound layer; and a first antenna electrically coupled to the semiconductor die, including: a first antenna element formed in the first redistribution layer structure; and a second antenna element formed between the second molding compound layer and the insulating cover layer. Therefore, the insulating covering layer can be used for protecting the second antenna element, antenna oxidation and surface damage during testing are avoided, the second antenna element can be reinforced, and the possibility that the second antenna element falls off</description><language>chi ; eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220805&amp;DB=EPODOC&amp;CC=CN&amp;NR=114864559A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220805&amp;DB=EPODOC&amp;CC=CN&amp;NR=114864559A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN ZIHONG</creatorcontrib><creatorcontrib>LIU NAIWEI</creatorcontrib><creatorcontrib>QI YANYAO</creatorcontrib><creatorcontrib>XU WENSONG</creatorcontrib><title>Semiconductor packaging structure</title><description>The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die and the first molding compound layer; a second molding compound layer formed on the first redistribution layer structure; an insulating cover layer covering the second molding compound layer; and a first antenna electrically coupled to the semiconductor die, including: a first antenna element formed in the first redistribution layer structure; and a second antenna element formed between the second molding compound layer and the insulating cover layer. Therefore, the insulating covering layer can be used for protecting the second antenna element, antenna oxidation and surface damage during testing are avoided, the second antenna element can be reinforced, and the possibility that the second antenna element falls off</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAMTs3NTM7PSylNLskvUihITM5OTM_MS1coLikCCpUWpfIwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NRioI7UvNSSeGc_Q0MTCzMTU1NLR2Ni1AAAwl0mUw</recordid><startdate>20220805</startdate><enddate>20220805</enddate><creator>LIN ZIHONG</creator><creator>LIU NAIWEI</creator><creator>QI YANYAO</creator><creator>XU WENSONG</creator><scope>EVB</scope></search><sort><creationdate>20220805</creationdate><title>Semiconductor packaging structure</title><author>LIN ZIHONG ; LIU NAIWEI ; QI YANYAO ; XU WENSONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114864559A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIN ZIHONG</creatorcontrib><creatorcontrib>LIU NAIWEI</creatorcontrib><creatorcontrib>QI YANYAO</creatorcontrib><creatorcontrib>XU WENSONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIN ZIHONG</au><au>LIU NAIWEI</au><au>QI YANYAO</au><au>XU WENSONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor packaging structure</title><date>2022-08-05</date><risdate>2022</risdate><abstract>The invention discloses a semiconductor packaging structure. The semiconductor packaging structure comprises a semiconductor crystal grain; a first molding compound layer surrounding the semiconductor die; a first redistribution layer structure formed on an inactive surface of the semiconductor die and the first molding compound layer; a second molding compound layer formed on the first redistribution layer structure; an insulating cover layer covering the second molding compound layer; and a first antenna electrically coupled to the semiconductor die, including: a first antenna element formed in the first redistribution layer structure; and a second antenna element formed between the second molding compound layer and the insulating cover layer. Therefore, the insulating covering layer can be used for protecting the second antenna element, antenna oxidation and surface damage during testing are avoided, the second antenna element can be reinforced, and the possibility that the second antenna element falls off</abstract><oa>free_for_read</oa></addata></record>
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subjects ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor packaging structure
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T16%3A35%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIN%20ZIHONG&rft.date=2022-08-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114864559A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true