T/R assembly micro-through-wall transition structure and T/R assembly
The invention provides a T/R assembly micro through-wall transition structure and a T/R assembly, and belongs to the technical field of microwave millimeter waves and terahertz, the T/R assembly micro through-wall transition structure comprises a substrate, the front surface of the substrate is prov...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a T/R assembly micro through-wall transition structure and a T/R assembly, and belongs to the technical field of microwave millimeter waves and terahertz, the T/R assembly micro through-wall transition structure comprises a substrate, the front surface of the substrate is provided with a gold-plated bonding pad, and the back surface of the substrate is provided with a BGA ball mounting bonding pad; the substrate is provided with plated-through holes which are connected with the gold-plated bonding pads and the BGA ball mounting bonding pads. The T/R assembly comprises a box body with a front cavity and a back cavity, a box body partition wall, a microwave plate, a control panel and a T/R assembly micro through-wall transition structure. According to the T/R assembly micro-through-wall transition structure provided by the invention, the micro-through-wall transition structure convenient for automatic production is utilized, and compared with a traditional insulator transition pin, the si |
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