Wafer probe card and wafer detection equipment

The invention relates to the field of electronic integrated circuit detection, and particularly discloses a wafer probe card and wafer detection equipment, which comprise a device probe and a monitoring probe cluster, the monitoring probe cluster comprises a main probe and a first auxiliary probe; t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUN XU, LIN TIANYING, HU CHAOYANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING ANGLES MEASURING AREAS MEASURING ELECTRIC VARIABLES MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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Beschreibung
Zusammenfassung:	The invention relates to the field of electronic integrated circuit detection, and particularly discloses a wafer probe card and wafer detection equipment, which comprise a device probe and a monitoring probe cluster, the monitoring probe cluster comprises a main probe and a first auxiliary probe; the lowest end of the first auxiliary probe is higher than the device probe, and the lowest end of the main probe is lower than the device probe; after the main probe is in contact with the wafer to be tested, the main probe slides along a first direction along with the continuous downward pressing of the wafer probe card, and when the main probe is in contact with the wafer to be tested and the distance between the wafer probe card and the wafer to be tested is continuously shortened by a first distance, the main probe slides along a second direction along with the continuous downward pressing of the wafer probe card. And the main probe is in contact connection with the first auxiliary probe to form an alarm loop.