Electronic device and heat insulation module thereof

The embodiment of the invention relates to an electronic device and a heat insulation module. The electronic device comprises an outer shell, a sensing module and the heat insulation module. The sensing module comprises a circuit board, a sensing unit and a heating unit, wherein the sensing unit and the heating unit are arranged on the circuit board. The heating unit is used for heating the sensing unit. The heat insulation module is contained in the outer shell and comprises a shell assembly and a heat insulation filling material. The sensing module is accommodated in the shell assembly. The heat insulation filling material is arranged between the circuit board of the sensing module and the inner wall surface of the shell assembly, and contacts and covers the heating unit. 本发明实施例涉及一种电子装置及绝热模组，电子装置包含一外壳体、一感测模组以及一绝热模组。感测模组包含一电路板以及设置于电路板的一感测单元与一加热单元。加热单元用于加热感测单元。绝热模组容置于外壳体内且包含一壳体组件以及一隔热填充材。感测模组容置于壳体组件中。隔热填充材介于感测模组的电路板与壳体组件的内壁面之间，接触并覆盖加热单元。