Positive photosensitive resin composition

Disclosed are a positive photosensitive resin composition and a manufacturing method using the same. A positive photosensitive resin composition including: a polymer resin including i) 5 to 95 wt% of a polyimide precursor having a structural unit represented by Chemical Formula 1, ii) 5 to 95 wt% of a polyimide having a structural unit represented by Chemical Formula 2, and iii) 0 to 20 wt% of a polyimide precursor having a structural unit represented by Chemical Formula 3; a quinonediazide compound contained in an amount of 5 to 50 parts by weight relative to 100 parts by weight of the polymer resin; and a solvent including 100 to 2,000 parts by weight with respect to 100 parts by weight of the polymer resin. 公开一种正型感光性树脂组合物以及利用所述树脂组合物的制造方法。正型感光性树脂组合物，包含：聚合物树脂，包含i)具有以化学式1表示的结构单元的聚酰亚胺前驱体5至95重量％、ii)具有以化学式2表示的结构单元的聚酰亚胺5至95重量％以及iii)具有以化学式3表示的结构单元的聚酰亚胺前驱体0至20重量％；醌二叠氮化合物，相对于所述聚合物树脂100重量份包含5至50重量份；以及，溶剂，相对于所述聚合物树脂100重量份包含100至2,000重量份。