Ultrasonic bonding of security devices to substrates for acquisition prevention

A security document (200) includes a substrate (205) having a first surface and a second surface opposite the first surface, the first surface having a cellulosic material. The security document further includes an optical security device (220) having an optical marking of the authenticity of the se...

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Hauptverfasser: SUBRAMANIAN PATTABIRAMAN, ZIEGLER ERIC M
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A security document (200) includes a substrate (205) having a first surface and a second surface opposite the first surface, the first surface having a cellulosic material. The security document further includes an optical security device (220) having an optical marking of the authenticity of the security document and a third surface having a thermoplastic polymer. The security document also includes an ultrasonic weld (225) that forms a bond between a section of the first surface and a section of the third surface. 一种安全文件(200)包括衬底(205),所述衬底具有第一表面和与所述第一表面相对的第二表面,所述第一表面具有纤维素材料。所述安全文件还包括光学安全装置(220),所述光学安全装置具有所述安全文件的真实性的光学标记和第三表面,所述第三表面具有热塑性聚合物。所述安全文件还包括超声焊缝(225),所述超声焊缝在所述第一表面的一个区段与所述第三表面的一个区段之间形成粘合部。