Three-dimensional packaging structure and packaging method of power device

The invention belongs to the technical field of semiconductors, and particularly relates to a three-dimensional packaging structure and packaging method of a power device, and the three-dimensional packaging structure of the power device comprises a lead frame which is provided with a bonding pad used for connecting the power device; the first power device is arranged on the lead frame in an inverted mode; the second power device is stacked on the first power device; wherein a bottom terminal of the first power device is fixedly connected with a bonding pad of the lead frame, and a top terminal of the first power device is electrically connected with a bottom terminal, close to the first power device, of the second power device in a copper strip bonding mode. And the bottom terminal of the first power device is also electrically connected with the top terminal of the second power device in a copper strip bonding manner. Through stacking the power devices, the number of routing required by packaging is reduced