SEMICONDUCTOR PACKAGE

The invention provides a semiconductor package. Embodiments of the present disclosure provide integrated circuit dies with vertical interconnect features that enable direct connections between vertically stacked integrated circuit dies. Vertical interconnect features may be formed in the sealing rin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI MINGHAN, YANG SHIYI, SUI XIAOLIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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