Semiconductor package

A semiconductor package includes: a first die; a second die stacked on an upper surface of the first die, the second die including a second semiconductor substrate and a second seal ring structure extending along a periphery of the second semiconductor substrate; a third die stacked on an upper surface of the first die, the third die including a third semiconductor substrate and a third seal ring structure extending along a periphery of the third semiconductor substrate; and a connection circuit extending through the second seal ring structure and the third seal ring structure in a lateral direction perpendicular to a stacking direction of the first die and the second die to electrically connect the second semiconductor substrate and the third semiconductor substrate. 一种半导体封装，包括：第一晶粒；第二晶粒，堆叠在第一晶粒的上表面上，第二晶粒包括第二半导体基板和沿着第二半导体基板的周边延伸的第二密封环结构；第三晶粒，堆叠在第一晶粒的上表面上，第三晶粒包括第三半导体基板和沿着第三半导体基板的周边延伸的第三密封环结构；以及连接电路，在与第一晶粒和第二晶粒的堆叠方向垂直的横向方向上延伸穿过第二密封环结构与第三密封环结构，以电连接第二半导体基板和第三半导体基板。