System, apparatus, and method for airflow optimization including adjacent FOUP

The present disclosure relates to systems, apparatuses, and methods for airflow optimization including adjacent FOUPs. A system includes a front open wafer transfer cassette (FOUP) configured to hold one or more semiconductor wafers; and a loading platform having a table and a receiving portion extending above the table. And the FOUP is positioned on the working table. A fan filter unit (FFU) is located above the loading platform. An airflow optimizer device is disposed on the receiving portion and below the FFU. The airflow optimizer apparatus has an inlet opening and an outlet opening, and a channel extending between the inlet opening and the outlet opening. 本公开涉及用于包括相邻FOUP的气流优化的系统、设备和方法。一种系统包括：前开式晶圆传送盒(FOUP)，被配置为保持一个或多个半导体晶圆；和加载平台，具有工作台和在所述工作台上方延伸的接收部分。所述FOUP位于所述工作台上。风扇过滤器单元(FFU)位于所述加载平台上方。气流优化器设备被设置在所述接收部分上和所述FFU下方。所述气流优化器设备具有入口开口和出口开口，以及在所述入口开口和所述出口开口之间延伸的通道。