SEMICONDUCTOR WAFER COOLING METHOD AND SYSTEM

The embodiment of the invention provides a semiconductor wafer cooling method and system. The cooling controller receives wafer information associated with the wafer from one or more sensors. The cooling controller determines a pattern mask area of the wafer based on the wafer information. The cooling controller determines a cooling time of the wafer based on the pattern mask area. The cooling controller equalizes the duration in which the cooling plate cools the wafer to the cooling time. Determining the cooling time of the wafer based on the pattern mask area provides a stable and consistent wafer temperature for wafers with different mask and layout properties, which reduces mask overlay variations and increases wafer yield. 本公开实施例提供一种半导体晶片冷却方法和系统。冷却控制器从一个或多个传感器接收与晶片相关联的晶片信息。冷却控制器基于晶片信息确定晶片的图案掩模面积。冷却控制器基于图案掩模面积确定晶片的冷却时间。冷却控制器使冷却板冷却晶片的持续时间与冷却时间相等。基于图案掩模面积确定晶片的冷却时间为具有不同掩模及布局性质的晶片提供稳定且一致的晶片温度，此会减少掩模上覆变化并增大晶片良率。