High-brightness liquid photosensitive solder mask ink and preparation method thereof
The invention relates to the field of C09D11/00, in particular to high-brightness liquid photosensitive solder mask ink and a preparation method thereof, and provides environment-friendly high-brightness liquid photosensitive solder mask ink which is prepared from 100-150 parts of modified acrylic r...
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| creator | LI BIAO CAO ZHIBIN SHA WANGBO LI YAO LI FAJIA |
| description | The invention relates to the field of C09D11/00, in particular to high-brightness liquid photosensitive solder mask ink and a preparation method thereof, and provides environment-friendly high-brightness liquid photosensitive solder mask ink which is prepared from 100-150 parts of modified acrylic resin, 15-22 parts of a curing agent, 3-8 parts of a curing agent accelerant, 15-22 parts of a photoinitiator, 3-6 parts of auxiliaries, 30-50 parts of a solvent and 80-105 parts of filler. The provided liquid photosensitive solder mask ink is high in glossiness and high in curing speed, the curing effect of the solder mask ink on a PCB is guaranteed, shrinkage stress generated during resin curing is reduced, the situation that the application of the solder mask ink in a flexible circuit board is limited due to the fact that the brittleness of a film layer is large after the ink is cured is avoided, meanwhile, the adhesive force performance and the solder mask performance of the ink are guaranteed, and the service l |
| format | Patent |
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The provided liquid photosensitive solder mask ink is high in glossiness and high in curing speed, the curing effect of the solder mask ink on a PCB is guaranteed, shrinkage stress generated during resin curing is reduced, the situation that the application of the solder mask ink in a flexible circuit board is limited due to the fact that the brittleness of a film layer is large after the ink is cured is avoided, meanwhile, the adhesive force performance and the solder mask performance of the ink are guaranteed, and the service l</description><language>chi ; eng</language><subject>ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220729&DB=EPODOC&CC=CN&NR=114806269A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220729&DB=EPODOC&CC=CN&NR=114806269A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI BIAO</creatorcontrib><creatorcontrib>CAO ZHIBIN</creatorcontrib><creatorcontrib>SHA WANGBO</creatorcontrib><creatorcontrib>LI YAO</creatorcontrib><creatorcontrib>LI FAJIA</creatorcontrib><title>High-brightness liquid photosensitive solder mask ink and preparation method thereof</title><description>The invention relates to the field of C09D11/00, in particular to high-brightness liquid photosensitive solder mask ink and a preparation method thereof, and provides environment-friendly high-brightness liquid photosensitive solder mask ink which is prepared from 100-150 parts of modified acrylic resin, 15-22 parts of a curing agent, 3-8 parts of a curing agent accelerant, 15-22 parts of a photoinitiator, 3-6 parts of auxiliaries, 30-50 parts of a solvent and 80-105 parts of filler. 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The provided liquid photosensitive solder mask ink is high in glossiness and high in curing speed, the curing effect of the solder mask ink on a PCB is guaranteed, shrinkage stress generated during resin curing is reduced, the situation that the application of the solder mask ink in a flexible circuit board is limited due to the fact that the brittleness of a film layer is large after the ink is cured is avoided, meanwhile, the adhesive force performance and the solder mask performance of the ink are guaranteed, and the service l</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | High-brightness liquid photosensitive solder mask ink and preparation method thereof |
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