High-brightness liquid photosensitive solder mask ink and preparation method thereof
The invention relates to the field of C09D11/00, in particular to high-brightness liquid photosensitive solder mask ink and a preparation method thereof, and provides environment-friendly high-brightness liquid photosensitive solder mask ink which is prepared from 100-150 parts of modified acrylic r...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the field of C09D11/00, in particular to high-brightness liquid photosensitive solder mask ink and a preparation method thereof, and provides environment-friendly high-brightness liquid photosensitive solder mask ink which is prepared from 100-150 parts of modified acrylic resin, 15-22 parts of a curing agent, 3-8 parts of a curing agent accelerant, 15-22 parts of a photoinitiator, 3-6 parts of auxiliaries, 30-50 parts of a solvent and 80-105 parts of filler. The provided liquid photosensitive solder mask ink is high in glossiness and high in curing speed, the curing effect of the solder mask ink on a PCB is guaranteed, shrinkage stress generated during resin curing is reduced, the situation that the application of the solder mask ink in a flexible circuit board is limited due to the fact that the brittleness of a film layer is large after the ink is cured is avoided, meanwhile, the adhesive force performance and the solder mask performance of the ink are guaranteed, and the service l |
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