Forming device

The heat conduction coating comprises a main soldering flux, an auxiliary soldering flux, a plasticizer, a filler, a refractory material, a heat conduction material, a heat preservation material and a solvent. The invention also discloses a method for preparing the heat-conducting coating and a form...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LYU LIANKAI, HUANG ZHONGWAN, TALIB, MOHD, TAZUL, AKMAL BIN, RATNAM, DILIP, ERANGOVAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The heat conduction coating comprises a main soldering flux, an auxiliary soldering flux, a plasticizer, a filler, a refractory material, a heat conduction material, a heat preservation material and a solvent. The invention also discloses a method for preparing the heat-conducting coating and a former with the heat-conducting coating. 一种导热涂料，所述导热涂料包括主助焊剂、辅助焊剂、增塑剂、填料、耐火材料、导热材料、保热材料和溶剂。本发明还公开了制备所述导热涂层的方法及具有所述导热涂层的成形器。