Structural lead frame

An improved electronic component package is provided. The electronic component package includes a plurality of electronic components, where each electronic component includes a first external wiring device and a second external wiring device. The electronic component package also includes a structur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DEMPTON, ALAN, BURKE, JAMES, A, MILLER GALEN W, HAYES HUNTER, JONES LONNIE G, BLAIS PETER ALEXANDER, LIPPS, MARK, R, BLATTIED, JOHN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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