Structural lead frame

An improved electronic component package is provided. The electronic component package includes a plurality of electronic components, where each electronic component includes a first external wiring device and a second external wiring device. The electronic component package also includes a structur...

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Bibliographische Detailangaben
Hauptverfasser:	DEMPTON, ALAN, BURKE, JAMES, A, MILLER GALEN W, HAYES HUNTER, JONES LONNIE G, BLAIS PETER ALEXANDER, LIPPS, MARK, R, BLATTIED, JOHN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An improved electronic component package is provided. The electronic component package includes a plurality of electronic components, where each electronic component includes a first external wiring device and a second external wiring device. The electronic component package also includes a structural lead frame including a plurality of leads, where each lead is mounted to at least one first external wiring device, and the structural lead frame includes at least one disengagement feature between adjacent leads. 提供了一种改进的电子部件封装件。电子部件封装件包括多个电子部件，其中，每个电子部件包括第一外部接线装置和第二外部接线装置。电子部件封装件还包括结构引线框架，该结构引线框架包括多个引线，其中，每个引线安装至至少一个第一外部接线装置，并且结构引线框架包括在相邻的引线之间的至少一个脱离特征件。