Mini LED packaging bonding pad design method

Mini LED packaging bonding pad design method

The invention discloses a Mini LED packaging bonding pad design method, and the method specifically comprises the steps: S1, carrying out the work draft compensation of a line width and a bonding pad according to a design criterion; s2, the lamp bead PAD controls the size and also controls the PAD s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YANG JIAHUA, LENG YAJUAN, MAO YONGSHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YANG JIAHUA
LENG YAJUAN
MAO YONGSHENG
description The invention discloses a Mini LED packaging bonding pad design method, and the method specifically comprises the steps: S1, carrying out the work draft compensation of a line width and a bonding pad according to a design criterion; s2, the lamp bead PAD controls the size and also controls the PAD spacing; s3, copying a group of copy layers for a lamp bead bonding pad, and converting the bonding pad into a profile attribute; s4, respectively carrying out internal shrinkage and external expansion operation on the outline frame, and respectively leading out two groups of line segments for one vertex angle to find the vertex angle; s5, connecting the vertex angle and the intersection point of the two groups of junction lines of the bonding pad main body in an arc manner; s6, removing a useless reference line, and reserving a lead angle profile; s7, performing Surface copper sheet attribute conversion on the PAD lead angle profile, and converting a hollow lead angle into a solid copper lead angle; s8, selecting t
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN114786344A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN114786344A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN114786344A3</originalsourceid><addsrcrecordid>eNrjZNDxzczLVPBxdVEoSEzOTkzPzEtXSMrPSwHRBYkpCimpxZnpeQq5qSUZ-Sk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61GGhCal5qSbyzn6GhibmFmbGJiaMxMWoALFwo9w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Mini LED packaging bonding pad design method</title><source>esp@cenet</source><creator>YANG JIAHUA ; LENG YAJUAN ; MAO YONGSHENG</creator><creatorcontrib>YANG JIAHUA ; LENG YAJUAN ; MAO YONGSHENG</creatorcontrib><description>The invention discloses a Mini LED packaging bonding pad design method, and the method specifically comprises the steps: S1, carrying out the work draft compensation of a line width and a bonding pad according to a design criterion; s2, the lamp bead PAD controls the size and also controls the PAD spacing; s3, copying a group of copy layers for a lamp bead bonding pad, and converting the bonding pad into a profile attribute; s4, respectively carrying out internal shrinkage and external expansion operation on the outline frame, and respectively leading out two groups of line segments for one vertex angle to find the vertex angle; s5, connecting the vertex angle and the intersection point of the two groups of junction lines of the bonding pad main body in an arc manner; s6, removing a useless reference line, and reserving a lead angle profile; s7, performing Surface copper sheet attribute conversion on the PAD lead angle profile, and converting a hollow lead angle into a solid copper lead angle; s8, selecting t</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220722&amp;DB=EPODOC&amp;CC=CN&amp;NR=114786344A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220722&amp;DB=EPODOC&amp;CC=CN&amp;NR=114786344A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG JIAHUA</creatorcontrib><creatorcontrib>LENG YAJUAN</creatorcontrib><creatorcontrib>MAO YONGSHENG</creatorcontrib><title>Mini LED packaging bonding pad design method</title><description>The invention discloses a Mini LED packaging bonding pad design method, and the method specifically comprises the steps: S1, carrying out the work draft compensation of a line width and a bonding pad according to a design criterion; s2, the lamp bead PAD controls the size and also controls the PAD spacing; s3, copying a group of copy layers for a lamp bead bonding pad, and converting the bonding pad into a profile attribute; s4, respectively carrying out internal shrinkage and external expansion operation on the outline frame, and respectively leading out two groups of line segments for one vertex angle to find the vertex angle; s5, connecting the vertex angle and the intersection point of the two groups of junction lines of the bonding pad main body in an arc manner; s6, removing a useless reference line, and reserving a lead angle profile; s7, performing Surface copper sheet attribute conversion on the PAD lead angle profile, and converting a hollow lead angle into a solid copper lead angle; s8, selecting t</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDxzczLVPBxdVEoSEzOTkzPzEtXSMrPSwHRBYkpCimpxZnpeQq5qSUZ-Sk8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61GGhCal5qSbyzn6GhibmFmbGJiaMxMWoALFwo9w</recordid><startdate>20220722</startdate><enddate>20220722</enddate><creator>YANG JIAHUA</creator><creator>LENG YAJUAN</creator><creator>MAO YONGSHENG</creator><scope>EVB</scope></search><sort><creationdate>20220722</creationdate><title>Mini LED packaging bonding pad design method</title><author>YANG JIAHUA ; LENG YAJUAN ; MAO YONGSHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114786344A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG JIAHUA</creatorcontrib><creatorcontrib>LENG YAJUAN</creatorcontrib><creatorcontrib>MAO YONGSHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG JIAHUA</au><au>LENG YAJUAN</au><au>MAO YONGSHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mini LED packaging bonding pad design method</title><date>2022-07-22</date><risdate>2022</risdate><abstract>The invention discloses a Mini LED packaging bonding pad design method, and the method specifically comprises the steps: S1, carrying out the work draft compensation of a line width and a bonding pad according to a design criterion; s2, the lamp bead PAD controls the size and also controls the PAD spacing; s3, copying a group of copy layers for a lamp bead bonding pad, and converting the bonding pad into a profile attribute; s4, respectively carrying out internal shrinkage and external expansion operation on the outline frame, and respectively leading out two groups of line segments for one vertex angle to find the vertex angle; s5, connecting the vertex angle and the intersection point of the two groups of junction lines of the bonding pad main body in an arc manner; s6, removing a useless reference line, and reserving a lead angle profile; s7, performing Surface copper sheet attribute conversion on the PAD lead angle profile, and converting a hollow lead angle into a solid copper lead angle; s8, selecting t</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN114786344A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Mini LED packaging bonding pad design method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-03T23%3A13%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANG%20JIAHUA&rft.date=2022-07-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN114786344A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true