Mini LED packaging bonding pad design method

The invention discloses a Mini LED packaging bonding pad design method, and the method specifically comprises the steps: S1, carrying out the work draft compensation of a line width and a bonding pad according to a design criterion; s2, the lamp bead PAD controls the size and also controls the PAD spacing; s3, copying a group of copy layers for a lamp bead bonding pad, and converting the bonding pad into a profile attribute; s4, respectively carrying out internal shrinkage and external expansion operation on the outline frame, and respectively leading out two groups of line segments for one vertex angle to find the vertex angle; s5, connecting the vertex angle and the intersection point of the two groups of junction lines of the bonding pad main body in an arc manner; s6, removing a useless reference line, and reserving a lead angle profile; s7, performing Surface copper sheet attribute conversion on the PAD lead angle profile, and converting a hollow lead angle into a solid copper lead angle; s8, selecting t