Wafer cleaning assembly, cleaning device and cleaning method

The invention discloses a wafer cleaning assembly, a cleaning device and a cleaning method, and the cleaning assembly is used for cleaning a wafer and comprises a cleaning pool, a cleaning tank and a plurality of water nozzles. The left and right ends of the cleaning tank are connected to the inner...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JIANG HONGQUAN, FENG YONG, LI JIANER, HU ZHONGBO, ZHOU JIANYU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a wafer cleaning assembly, a cleaning device and a cleaning method, and the cleaning assembly is used for cleaning a wafer and comprises a cleaning pool, a cleaning tank and a plurality of water nozzles. The left and right ends of the cleaning tank are connected to the inner wall of the cleaning pool, and the bottom of the cleaning tank is suspended and opened; the water sprayers are disc-shaped and connected with water pipes, water spraying holes are formed in the two faces of each water sprayer, sprayer clamping grooves and wafer clamping grooves are formed in the cleaning tank at intervals, and the water sprayers are sequentially arranged in the sprayer clamping grooves; and a plurality of wafers are sequentially arranged in the wafer clamping grooves. According to the wafer cleaning device, soaking type cleaning is changed into spraying type cleaning, each wafer can be cleaned, sewage can quickly flow away conveniently, and the cleaning effect and cleaning efficiency of the wafers