Hole array layer structure, pre-coating method, film forming method and related device

The embodiment of the invention provides a hole array layer structure, a pre-coating method, a film forming method and a related device, the hole array layer structure is used for forming a film forming space with a substrate, the film forming space is used for forming a film layer, the hole array l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG JIN, ZHAI WEI, GUO MINGZHAO, ZHANG YOUNA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The embodiment of the invention provides a hole array layer structure, a pre-coating method, a film forming method and a related device, the hole array layer structure is used for forming a film forming space with a substrate, the film forming space is used for forming a film layer, the hole array layer structure comprises a base plate, a plurality of hole units are arranged in an array in the base plate, the hole units penetrate through the base plate, and the hole units are arranged in the base plate. Each hole unit comprises a first hole part and a second hole part which are stacked in the thickness direction of the substrate, the second hole part is configured to be connected with the substrate, the projection of the first hole part on a plane perpendicular to the thickness direction of the substrate has a first hole part contour, and the projection of the second hole part on a plane perpendicular to the thickness direction of the substrate has a second hole part contour; the first hole part contours surr