Production process for improving thermoelectric separation heat conduction efficiency of metal circuit board through stamping method

The invention belongs to the field of circuit board production, particularly relates to a production process for improving thermoelectric separation heat conduction efficiency of a metal circuit board through a stamping method, and aims to solve the problem that good heat transfer of a heating power element cannot be completed in the prior art. Manufacturing a circuit diagram, an insulating layer PP diagram, a copper substrate three-dimensional diagram and a film diagram; s2, laminating the copper foil and the insulating layer: laminating the copper foil and the insulating layer; s3, circuit etching is carried out; and S4, punching the insulating layer: taking the position of the heat dissipation bonding pad as a coordinate, directly skipping the limitation of about 5W/(M * K) heat conductivity coefficient of the insulating layer, directly improving the heat conductivity coefficient to about 400W/(M * K) of copper, improving the heat conductivity coefficient of the whole circuit board from about 5W/(M * K) to