Silicon carbide pipeline cutting process
The invention discloses a silicon carbide pipeline cutting-off process. The silicon carbide pipeline cutting-off process specifically comprises the following steps that S1, raw materials containing silicon carbide are put into a pipeline forming mold to be subjected to forming machining; s2, then th...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a silicon carbide pipeline cutting-off process. The silicon carbide pipeline cutting-off process specifically comprises the following steps that S1, raw materials containing silicon carbide are put into a pipeline forming mold to be subjected to forming machining; s2, then the silicon carbide pipeline is transported through a transporting device; s3, the silicon carbide pipeline is cut off through a cutting-off device; the invention relates to the technical field of silicon carbide. According to the silicon carbide pipeline cutting-off process, through the arrangement of the automatic fixed cutting-off mechanism, equidistant cutting can be conveniently achieved according to movement of a silicon carbide pipeline, cutting can be achieved while movement is conducted, the cutting-off efficiency is high, cutting-off can be conducted without an independent driving element, the treatment cost is low, and the automation degree is high; the moving and equidistant cutting work of the pipeline c |
---|