Loudspeaker system cooling

The present disclosure provides a speaker system that includes a linear array assembly and a base for supporting the linear array assembly. The linear array assembly includes a plurality of electro-acoustic transducers arranged along a vertical axis, and the base accommodates electronics for powerin...

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Hauptverfasser: MACDONALD THOMAS E, SANTORO PETER C
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present disclosure provides a speaker system that includes a linear array assembly and a base for supporting the linear array assembly. The linear array assembly includes a plurality of electro-acoustic transducers arranged along a vertical axis, and the base accommodates electronics for powering the linear array assembly. The base and the linear array assembly collectively define a flow path to facilitate a convective airflow to pass between the base and the linear array assembly to cool the electronic device. 本公开提供了一种扬声器系统,该扬声器系统包括线性阵列组件和用于支撑该线性阵列组件的基座。该线性阵列组件包括沿着垂直轴线布置的多个电声换能器,并且该基座容纳用于为该线性阵列组件供电的电子器件。该基座和该线性阵列组件共同限定流动路径,以促进对流气流在该基座与该线性阵列组件之间传递,从而冷却该电子器件。