Sensor device

The sensor device (1) according to the invention comprises: a Peltier element (20); a sensor element (10) thermally connected to the cooling surface (21a) of the Peltier element (20); and a package substrate (40) which is thermally connected to a heat release surface (23a) of the Peltier element (20) and accommodates the Peltier element (20) and the sensor element (10). In addition, the package substrate (40) has, on at least a portion of a surface facing the heat emission surface (23a) of the Peltier element (20), a heat emission member (46) made of a material having a thermal conductivity higher than that of the material of the package substrate (40). 根据本发明的传感器装置(1)包括：珀耳帖元件(20)；传感器元件(10)，其热连接至所述珀耳帖元件(20)的冷却面(21a)；封装基板(40)，其热连接至所述珀耳帖元件(20)的放热面(23a)，并且容纳所述珀耳帖元件(20)和所述传感器元件(10)。另外，所述封装基板(40)在与所述珀耳帖元件(20)的所述放热面(23a)面对着的表面的至少一部分上具有由如下材料制成的放热部件(46)：该材料具有比所述封装基板(40)的材料的热导率更高的热导率。