Sensor device
A sensor device (1) according to the present disclosure comprises: a Peltier element (20); a sensor element (10) thermally connected to the cooling surface (21a) of the Peltier element (20); and a package substrate (40) made of ceramic, thermally connected to the heat dissipation surface (23a) of th...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A sensor device (1) according to the present disclosure comprises: a Peltier element (20); a sensor element (10) thermally connected to the cooling surface (21a) of the Peltier element (20); and a package substrate (40) made of ceramic, thermally connected to the heat dissipation surface (23a) of the Peltier element (20), and housing the Peltier element (20) and the sensor element (10).
根据本公开的传感器装置(1)包括：珀耳帖元件(20)；热连接到所述珀耳帖元件(20)的冷却面(21a)的传感器元件(10)；和封装基板(40)，其由陶瓷制成、热连接到所述珀耳帖元件(20)的散热面(23a)并且收容所述珀耳帖元件(20)和所述传感器元件(10)。 |
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