Wafer carrying manipulator with gravitational field sensor
Techniques and systems are disclosed for automatically determining and correcting the levelness of a wafer handling robot end effector. The system may use a tilt sensor or gravitational field sensor that may be corrected for the wafer handling robot. The output from the tilt sensor may be used to de...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Techniques and systems are disclosed for automatically determining and correcting the levelness of a wafer handling robot end effector. The system may use a tilt sensor or gravitational field sensor that may be corrected for the wafer handling robot. The output from the tilt sensor may be used to determine or estimate the tilt of an end effector of the wafer handling robot, and to perform modified positioning to reduce or remove the tilt, to automatically teach specific locations with reduced tilt, to perform a health check of the robot, to provide feedback to a user, and the like.
公开了用于自动地确定及校正晶片搬运机械手末端执行器的水平度的技术和系统。所述系统可使用可针对该晶片搬运机械手进行校正的倾斜传感器或重力场传感器。来自该倾斜传感器的输出可被用于确定或估计该晶片搬运机械手的末端执行器的倾斜,并且用于执行修正定位以减少或去除该倾斜,以自动地教导具有已减少的倾斜的特定位置,以执行对该机械手的健康检查,将反馈提供至使用者,等等。 |
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