Gas supply method, substrate processing method, and gas supply apparatus

In the present invention, a first supply step is performed in which a first gas as a carrier gas for a second gas generated by vaporizing a material is mixed with the second gas, and a mixed gas of the first gas and the second gas is supplied to a substrate or other processing object (cleaning removal). Next, a second supply step (evaporation drying) is performed in which the heated first gas is supplied to the object to be processed. As a result, it is possible to efficiently clean and remove foreign matter on the object to be processed. 在本发明中，进行第1供给工序，使第1气体作为通过使材料气化而生成的第2气体的载气与第2气体混合，将第1气体与第2气体的混合气体供给至基板等处理对象(清洗去除)。接着，进行将加热的第1气体向处理对象供给的第2供给工序(蒸发干燥)。由此，能够有效地进行处理对象上的异物的清洗以及去除。