Airtight chip structure and preparation method thereof

The invention relates to an airtight chip structure and a preparation method thereof. The method comprises the following steps: respectively electroplating at least one first copper ring and at least one first copper column on a top TSV chip provided with at least one first circuit area; respectivel...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TONG LIANGYU, YANG TING, AO GUOJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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