Improving photoresist resolution by anisotropic copper plating

The substrate features copper electroplated by a method that includes copper electroplating a selectively deposited seed layer or a seed layer of a photoresist-defining feature with a copper electroplating composition containing a selective inhibitor compound capable of anisotropic plating and a sel...

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Hauptverfasser:	GALLAGHER MICHAEL K, LACHOWSKI, JOSEPH, F, ZIELINSKI ANDREAS, HAMODY SIMON, LIFSCHITZ ARRIBIO ALEJO M, WILLIAMSON CLIFTON, PRANGE JONATHAN D
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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