Silicon-boron-carbon-nitrogen complex adhesive as well as preparation and use methods thereof
The invention discloses a silicon-boron-carbon-nitrogen complex adhesive which comprises the following raw materials in parts by weight: 30-50 parts of methyl vinyl phenyl silazane urea cyanuric melamine, 5-15 parts of hexagonal boron nitride, 40-50 parts of a tackifier and 5-10 parts of epoxy T-sha...
Gespeichert in:
Hauptverfasser: | , , , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses a silicon-boron-carbon-nitrogen complex adhesive which comprises the following raw materials in parts by weight: 30-50 parts of methyl vinyl phenyl silazane urea cyanuric melamine, 5-15 parts of hexagonal boron nitride, 40-50 parts of a tackifier and 5-10 parts of epoxy T-shaped structure multifunctional silane. During preparation, the raw materials are uniformly mixed according to the required proportion, then placed in a yarn grinding modification machine and subjected to extrusion molding, and the silicon-boron-carbon-nitrogen complex adhesive is prepared. The fluid silicon-boron-carbon-nitrogen composite adhesive is formed through reaction under the conditions of 200-300 DEG C and greater than or equal to 2MPa, and when in use, the fluid silicon-boron-carbon-nitrogen composite adhesive is mixed with a solvent and then sprayed on the surface of a base material to form a film. The design not only has excellent high temperature resistance, but also is simple in preparation process and |
---|