Chemical-mechanical planarization pad conditioner

The invention relates to a chemical-mechanical planarization pad conditioner. A chemical-mechanical planarization pad conditioner includes an article having a contact surface configured to contact a chemical-mechanical planarization pad during conditioning of the chemical-mechanical planarization pad; the article includes a matrix having a plurality of diamond particles distributed over a volume of the matrix, where the matrix includes silicon carbide, the matrix at the contact surface is recessed relative to the diamond particles such that some of the diamond particles partially protrude from the matrix, and where the matrix includes no more than 10 volume percent of in-situ formed silicon carbide. 本发明涉及一种化学-机械平面化垫调节器。化学-机械平面化垫调节器包括制品，该制品具有配置成用于在调节化学-机械平面化垫期间接触化学-机械平面化垫的接触表面；制品包括基质，基质具有遍及基质的体积分布的多个金刚石颗粒，其中基质包括碳化硅，在接触表面处的基质相对于金刚石颗粒是凹陷的使得一些金刚石颗粒从基质部分地突出，并且其中基质包含不超过10体积百分比的原位形成的碳化硅。