Bonding tool and bonding method

A bonding tool of an embodiment of the present invention includes a gas supply line that can extend directly between a valve associated with one or more gas supply tanks and a process chamber such that the gas supply line is uninterrupted without any intermediate valve or other type of structure, otherwise, the intermediate valve or other type of structure may cause pressure buildup in the gas supply line between the processing chamber and the valve associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or close to the pressure in the processing chamber such that the gas provided to the processing chamber via the gas supply line does not cause the pressure imbalance in the processing chamber, otherwise, the pressure imbalance may result in early or premature contact between semiconductor substrates to be bonded in the processing chamber. 本发明实施例的一种结合工具包括气体供应管线，所述气体供应管线可直接在和一个或多个气体供应罐相关联的阀门与处理腔室之间延伸，使得气体供应管线在无任何中间阀门或其他类型的结构的情况下不间断，否则所述中间阀门或其他类型的结构可能会导致在处理腔室与和所