Bonding head, chip bonding machine and bonding method

The invention relates to a bonding head, a chip bonding machine and a bonding method, the bonding head comprises a pick-up assembly, a plurality of flexible bodies and a plurality of control members, the pick-up assembly is used for picking up a chip, each flexible body comprises a first connecting...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHENG JIARUI, LI CHANGHONG, LI HU, ZHANG HAO, ZHOU KUANLIN, YIN ZUJIN, GENG XIAOMENG, HU JIN, WANG MINGJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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