Bonding head, chip bonding machine and bonding method

The invention relates to a bonding head, a chip bonding machine and a bonding method, the bonding head comprises a pick-up assembly, a plurality of flexible bodies and a plurality of control members, the pick-up assembly is used for picking up a chip, each flexible body comprises a first connecting end and a second connecting end, the first connecting ends of the plurality of flexible bodies are connected with the pick-up assembly, and the second connecting ends of the plurality of flexible bodies are connected with the pick-up assembly. The second connecting ends of the multiple flexible bodies are correspondingly connected with the multiple control pieces respectively, and the control pieces can control the distance between the first connecting ends and the second connecting ends. According to the bonding head, the chip and the substrate can be leveled in a self-adaptive manner, and the bonding precision of the chip and the substrate is improved. The chip bonding machine comprises the bonding head, and the