Lossless planar chip inductance test assembly and manufacturing method thereof

The invention discloses a lossless planar chip inductance testing assembly and a manufacturing method thereof, and belongs to the field of electronic component testing. The test assembly comprises a base, an embedded part and a calibration part. The base comprises a base substrate, a positioning cav...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI DEYIN, JIA PENGLE, ZENG YUJIN, CHENG CHEN, PANG JINBIAO, HAN YUCHENG, TAN TIANBO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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