Forming method for moulded hollow plastic shell

一种形成模制的中空塑料外壳的方法。由晶片组成的密封在中空塑料外壳内的用导电的导线穿透外壁以连接晶片电路的电子组件这样制造：仅在导线表面会与外壳材料交接的部位向导线施涂可热固化粘合剂，在导线周围模制组件，并在模制过程或后固化期间固化粘合剂。所述粘合剂配制成可在导线周围形成气密性密封，并在制造组件和与其他电路电连接时所包括的一般工序中，在部件要经受的热循环期间，也在使用时完成和装配制品要经受的一般的环境变化期间，保持密封性。尤其要选择粘合剂，使之容许导线与外壳材料之间的热膨胀系数差，同时仍保持气密性密封。 Electronic packages that consist of dies sealed within hollow plastic enclosures with electrically conductive leads penetrating the enclosure walls to access the die circuitry are manufactured by applying a heat-curable adhesive to the leads at only those locations where the surfaces of the leads will interface with the enclosure material, molding the package around the leads, and curing the adhesive during the molding process or during a post-cure. The adhesive is formulated to form a gas-tight seal around the leads and to maintain the seal during the thermal cycling that the components are exposed to during the typical procedures involved in manufacturing the packages and in making the electrical connections to other circuitry, as well as the typical environmental changes that the finished and installed product is exposed to during use. In particular, the adhesive is selected to accommodate differences in the coefficients of thermal expansion between the leads and the enclosure material while still maintaining a vapor-tight seal.