Substrate bonding apparatus and substrate bonding method
The present invention provides a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus and a substrate bonding method, which simplify the structure of a substrate bonding apparatus for bonding substrates and reduce errors caused by misali...
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| Hauptverfasser: | , , , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The present invention provides a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus and a substrate bonding method, which simplify the structure of a substrate bonding apparatus for bonding substrates and reduce errors caused by misalignment of the substrates when the substrates are bonded.
本发明提供一种基板接合装置及基板接合方法，更具体地涉及一种简化接合基板的基板接合装置的结构，而且，在接合基板的情况下，减少因基板的错排而产生误差的基板接合装置及基板接合方法。 |
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