Optical chip subassembly, optical chip and method of assembling optical chip

An optical chip subassembly, an optical chip, and a method of assembling an optical chip. The optical chip subassembly includes: an input/output interface including a plurality of first type physical interfaces and a plurality of second type physical interfaces; and an optical functional device opti...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIANG YUXIN, FENG JUNBO, GUO JIN, OUYANG BOLING, CUI NAIDI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:An optical chip subassembly, an optical chip, and a method of assembling an optical chip. The optical chip subassembly includes: an input/output interface including a plurality of first type physical interfaces and a plurality of second type physical interfaces; and an optical functional device optically coupled to at least some of the plurality of physical interfaces of the first type and the plurality of physical interfaces of the second type. The plurality of first-type physical interfaces are configured to be detachably connectable with the second-type physical interfaces of the first another optical chip subassembly, and the plurality of second-type physical interfaces are configured to be detachably connectable with the first-type physical interfaces of the second another optical chip subassembly, such that the optical functional device is optically communicable with the optical functional device in the first further optical chip subassembly and the optical functional device in the second further optica