Integrated circuit device

An integrated circuit device includes: a semiconductor-on-insulator (SOI) substrate layer including a base substrate layer, an insulating substrate layer, and a capping substrate layer; a semiconductor substrate layer; a plurality of first fin-type active regions and a plurality of second fin-type a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOON SEOK-HYUN, PARK JUN-YOUNG, LEE SEUNG-HOON, SHIN WOOOL
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:An integrated circuit device includes: a semiconductor-on-insulator (SOI) substrate layer including a base substrate layer, an insulating substrate layer, and a capping substrate layer; a semiconductor substrate layer; a plurality of first fin-type active regions and a plurality of second fin-type active regions, the plurality of first fin-type active regions and the plurality of second fin-type active regions being defined by a plurality of trenches and respectively extending in a first horizontal direction over the SOI substrate layer and the semiconductor substrate layer; a plurality of nanosheet stacked structures including a plurality of nanosheets extending parallel to each other and spaced apart from upper surfaces of the plurality of first fin-type active regions and the plurality of second fin-type active regions; a plurality of first source/drain regions extending into the SOI substrate layer; and a plurality of second source/drain regions extending into the semiconductor substrate layer. Lower surf