Integrated circuit device
An integrated circuit device includes: a semiconductor-on-insulator (SOI) substrate layer including a base substrate layer, an insulating substrate layer, and a capping substrate layer; a semiconductor substrate layer; a plurality of first fin-type active regions and a plurality of second fin-type a...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | An integrated circuit device includes: a semiconductor-on-insulator (SOI) substrate layer including a base substrate layer, an insulating substrate layer, and a capping substrate layer; a semiconductor substrate layer; a plurality of first fin-type active regions and a plurality of second fin-type active regions, the plurality of first fin-type active regions and the plurality of second fin-type active regions being defined by a plurality of trenches and respectively extending in a first horizontal direction over the SOI substrate layer and the semiconductor substrate layer; a plurality of nanosheet stacked structures including a plurality of nanosheets extending parallel to each other and spaced apart from upper surfaces of the plurality of first fin-type active regions and the plurality of second fin-type active regions; a plurality of first source/drain regions extending into the SOI substrate layer; and a plurality of second source/drain regions extending into the semiconductor substrate layer. Lower surf |
---|