Production process of solvent type super-thick base-material-free double-faced adhesive tape
The invention discloses a production process of a solvent-based super-thick substrate-free double faced adhesive tape, which is characterized by comprising the following steps: S1, coating release paper with a release force of 8-15 gf/25 mm with solvent-based pressure-sensitive adhesive glue, drying...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a production process of a solvent-based super-thick substrate-free double faced adhesive tape, which is characterized by comprising the following steps: S1, coating release paper with a release force of 8-15 gf/25 mm with solvent-based pressure-sensitive adhesive glue, drying the release paper by a coating machine, and directly rolling the release paper to obtain a semi-finished product A; s2, release paper or a release film with the release force of 3-5 gf/25 mm is coated with the same solvent type pressure-sensitive adhesive glue, the coating width is reduced by 4-6 mm compared with the single side of the semi-finished product A, after the release paper or the release film is dried through a coating machine, adhesive faces and adhesive faces of the semi-finished product A and the semi-finished product A are oppositely attached, then the second layer of release paper is uncovered, and the first layer of release paper is reserved and rolled; s3, the step S2 is repeated, third-layer coa |
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