Cleaning composition

The invention discloses a cleaning composition. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and the hydrogen bond acceptor are present in a molar ratio of about 5: 1 to about 1.5: 1. 本发明公开了一种清洁组合物。该清洁组合物包含羟酸、氢键受体和表面活性剂。羟酸和氢键受体以约5:1至约...

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Bibliographische Detailangaben
Hauptverfasser: BARNABAS, FREDDY, ARTHUR, VANIN GREGORY THOMAS, BACA LORI ANN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a cleaning composition. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and the hydrogen bond acceptor are present in a molar ratio of about 5: 1 to about 1.5: 1. 本发明公开了一种清洁组合物。该清洁组合物包含羟酸、氢键受体和表面活性剂。羟酸和氢键受体以约5:1至约1.5:1的摩尔比存在。