Cleaning composition
The invention discloses a cleaning composition. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and the hydrogen bond acceptor are present in a molar ratio of about 5: 1 to about 1.5: 1. 本发明公开了一种清洁组合物。该清洁组合物包含羟酸、氢键受体和表面活性剂。羟酸和氢键受体以约5:1至约...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a cleaning composition. The cleaning composition includes a hydroxy acid, a hydrogen bond acceptor, and a surfactant. The hydroxy acid and the hydrogen bond acceptor are present in a molar ratio of about 5: 1 to about 1.5: 1.
本发明公开了一种清洁组合物。该清洁组合物包含羟酸、氢键受体和表面活性剂。羟酸和氢键受体以约5:1至约1.5:1的摩尔比存在。 |
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