Silver alloy bonding wire and manufacturing method thereof

The invention belongs to the technical field of alloy materials, and particularly relates to a silver alloy bonding wire and a manufacturing method thereof. The silver alloy bonding wire comprises a core wire and a gold plating layer wrapping the surface of the core wire, the core wire comprises, by mass, 10-30% of gold, 0.1-5.0% of palladium, 5-100 ppm of calcium, 5-100 ppm of cerium and the balance silver, and the gold content of the gold plating layer accounts for 3-5% of the total mass of the gold content in the core wire. Through casting, wire drawing, gold plating and annealing processes, the silver alloy bonding wire with good mechanical properties and stability is obtained, and the silver alloy bonding wire can be directly used for medium and high-end LED packaging and IC packaging under the condition that equipment is not changed or upgraded. And the gold content in the traditional bonding wire for packaging middle and high-end products needs to reach 60-80% or above, while the gold content in the si