Chemical mechanical polishing compositions and methods of use thereof

The invention relates to chemical mechanical polishing compositions and methods of using the same. The present invention relates to a polishing composition comprising at least one abrasive, at least one organic acid, at least one anionic surfactant comprising at least a phosphate, at least one phosphonic acid compound having a molecular weight of less than 500 g/mol, at least one azole-containing compound, at least one alkylamine compound having an alkyl chain of 6 to 24 carbons, and an aqueous solvent, and optionally, a pH regulator. 本发明涉及化学机械抛光组合物及其使用方法。本发明涉及一种抛光组合物，包含：至少一种磨料、至少一种有机酸、至少一种含有至少磷酸盐/酯的阴离子表面活性剂、至少一种分子量低于500g/mol的膦酸化合物、至少一种含唑化合物、至少一种具有6至24碳烷基链的烷基胺化合物、和水性溶剂，以及任选地，pH调节剂。