Power device heat dissipation device and automatic assembly control method and control system thereof

The invention discloses a power device heat dissipation device and an automatic assembly control method and a control system thereof, the heat dissipation device comprises a heat conduction gasket, the heat conduction gasket is arranged on a heat dissipation contact surface of a power device, the he...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DENG WENKAI, ZHONG CHANGXIA, XIAO JIE, LYU YONGBIN, SHEN LIANG, LIU REN, HAO ZHENZHEN, ZHENG CHUNLONG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a power device heat dissipation device and an automatic assembly control method and a control system thereof, the heat dissipation device comprises a heat conduction gasket, the heat conduction gasket is arranged on a heat dissipation contact surface of a power device, the heat dissipation contact surface is provided with more than one groove, the heat conduction gasket is an elastic heat conduction gasket which has elasticity and can be bent, and the heat conduction gasket is arranged in the groove. A mounting flat plate is pressed on the heat-conducting gasket, and the heat-conducting gasket is pressed on the heat dissipation contact surface through the mounting flat plate, so that the heat-conducting gasket is attached to the heat dissipation contact surface and the surface of the groove; according to the method, automatic assembly of the heat dissipation device is achieved. The method has the advantages of being easy to implement, low in cost, good in heat dissipation effect and th