一种瘤球针状低轮廓铜箔的制备技术

本发明提供一种瘤球针状低轮廓铜箔的制备技术,该制备技术包括:对粗化铜箔进行瘤球化处理,以在粗化铜箔的表面形成具有若干个瘤球件的电镀层,得到固化铜箔;对固化铜箔进行针状处理,以在固化铜箔的表面形成粗糙层,得到低轮廓铜箔,其中,粗糙层包括形成于电镀层表面的多个纳米级的针状件,针状件与瘤球件形成瘤球针状结构,针状件为铜结构件。本发明提供的瘤球针状低轮廓铜箔的制备技术能够在确保粗糙度尽可能小的情况下,使得瘤球针状低轮廓铜箔具有较高的抗剥离强度。 The invention provides a preparation technology of a tumor ball needle-shaped l...

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Zusammenfassung:本发明提供一种瘤球针状低轮廓铜箔的制备技术,该制备技术包括:对粗化铜箔进行瘤球化处理,以在粗化铜箔的表面形成具有若干个瘤球件的电镀层,得到固化铜箔;对固化铜箔进行针状处理,以在固化铜箔的表面形成粗糙层,得到低轮廓铜箔,其中,粗糙层包括形成于电镀层表面的多个纳米级的针状件,针状件与瘤球件形成瘤球针状结构,针状件为铜结构件。本发明提供的瘤球针状低轮廓铜箔的制备技术能够在确保粗糙度尽可能小的情况下,使得瘤球针状低轮廓铜箔具有较高的抗剥离强度。 The invention provides a preparation technology of a tumor ball needle-shaped low-profile copper foil, which comprises the following steps: performing tumor ball treatment on a roughened copper foil to form an electroplated layer with a plurality of tumor ball pieces on the surface of the roughened copper foil to obtain a cured copper foil; the cured copper foil is subjected to needle-shaped treatment, a rough layer is formed on the surface of the cured copper foil, the low-profile copper foil is obtained, the rough layer comprises a plurality of nanoscale needle-shaped pieces formed on the surface of the electroplated layer, the needle-shaped pieces and the tumor ball pieces form a tumor ball needle-shaped structure, and the needle-shaped pieces are copper structural pieces. According to the