Double-layer copper alloy powder metallurgy pantograph slide plate and manufacturing process thereof

The invention relates to the technical field of pantograph slide plate manufacturing, in particular to a double-layer copper alloy powder metallurgy pantograph slide plate and a manufacturing process thereof. The pantograph is formed by pressing a working layer copper alloy material and a bottom lay...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: XU YING, JIANG QINGSONG, YANG XINDE
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to the technical field of pantograph slide plate manufacturing, in particular to a double-layer copper alloy powder metallurgy pantograph slide plate and a manufacturing process thereof. The pantograph is formed by pressing a working layer copper alloy material and a bottom layer copper alloy material, the working layer copper alloy material comprises the following components in percentage by mass: 75-89% of 663 bronze powder, 1-4% of ferrochrome powder and 2-4% of tungsten copper powder; 1-2% of molybdenum powder, 6-12% of copper-plated graphite powder and 1-3% of molybdenum disulfide powder; the bottom layer copper alloy material comprises, by mass, 79%-90% of copper powder, 5%-10% of tin powder, 3%-7% of nickel powder and 2%-4% of artificial graphite. The double-layer copper alloy powder metallurgy pantograph slide plate has the advantages of being good in conductivity, high in arc abrasion resistance, good in mechanical abrasion resistance, low in noise and small in wire abrasion, is